Shinkawa Ltd

Production and sale of production device such as die/di bonder, wire bonder and the tape bonder which are used with semiconductor assembly process. Types Ecommerce -B2B (Business-to-Business)
Address
Japan, 208-8585
Telephone
+1-480-831-7988,042(560)1231
Fax
+1-480-831-9480
Website
www.shinkawa.com
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